Winome Enables Flexible Semiconductor Equipment Integration with ASRock Industrial IMB-X1715
To meet the increasing computing and control demands of advanced semiconductor packaging and testing equipment, Winome integrates flexible computing platforms based on the ASRock Industrial IMB-X1715 for high-resolution 3D AOI equipment. The platform supports vision inspection, motion control, I/O control, and peripheral connectivity within a single system. Powered by Intel® Core™ Ultra Series 2 processors and supporting up to 256GB of DDR5 memory, the IMB-X1715 provides the computing resources required for demanding inspection workloads while offering a cost-effective alternative to a Xeon-based platform. Its flexible PCIe architecture enables dedicated cards for different control functions to operate independently without requiring two-card synchronization. Combined with Winome's rapid local technical support and component replacement, the integrated solution delivers a high-performance, flexible, and cost-effective computing platform for advanced semiconductor inspection equipment.
Challenge
Semiconductor packaging and testing equipment increasingly combines high-resolution inspection, motion control, I/O, and peripheral communication within a single system. To meet the requirements of the semiconductor equipment manufacturer, Winome needed to support high inspection performance and yield cost-effectively, enable flexible system integration, and maintain 24/7 equipment availability with responsive service support.
Key challenges included:
- Maintaining Inspection Performance and Yield: Continuous high-volume image data from 25 MP high-speed frame grabbers requires sufficient CPU and memory resources to support demanding inspection and metrology workloads without performance bottlenecks that could affect inspection consistency and yield, while keeping the computing platform cost-effective.
- Enabling Flexible System Integration: The equipment requires flexible PCIe expansion to integrate vision inspection, motion control, and I/O functions within a single system. Competing solutions with two-card synchronization limitations created constraints for the required equipment architecture. Multiple RS-232 interfaces were also required for optical equipment, lighting systems, scanners, and other peripherals.
- Ensuring 24/7 Equipment Availability: Inspection, motion control, I/O, and peripheral communication operate simultaneously within the same equipment, requiring stable hardware operation under continuous workloads to minimize unexpected downtime. When hardware issues occur, rapid technical support and component replacement are also critical to shorten troubleshooting and service time and maintain high equipment availability.
Solution
To address the semiconductor equipment manufacturer's requirements for inspection performance and yield, flexible system integration, 24/7 operation, and rapid service support, Winome integrated industrial computing platform based on the ASRock Industrial IMB-X1715 ATX motherboard as the core computing platform for its semiconductor equipment solutions. The platform serves as the equipment's central computing and control platform, supporting 25 MP 3D vision inspection, real-time motion control, I/O handling, and equipment communication within a single system. Through platform selection and system configuration, Winome optimized the computing architecture to accommodate the equipment's vision inspection, motion control, I/O, and peripheral connectivity requirements while providing the expansion flexibility needed for different equipment configurations.
High-Performance Computing for Inspection Workloads
To maintain consistent inspection performance under high-volume image processing, Winome selected the IMB-X1715 as the computing foundation based on the equipment's processing and memory requirements. Powered by Intel® Core™ Ultra Series 2 processors with built-in AI acceleration (NPU) and supporting up to 256GB of DDR5 memory, the platform provides the processing performance and memory capacity required for 3D AOI image processing, AI-assisted inspection, and machine-control workloads, while offering a cost-effective alternative to a Xeon-based platform. By providing sufficient and consistent computing resources for high-volume image processing, the integrated platform helps minimize processing bottlenecks and support stable inspection performance and yield.
Flexible Integration of Vision, Motion, and I/O
Based on the equipment's expansion and control requirements, Winome configured the IMB-X1715's flexible 7-slot PCIe architecture to support dedicated cards for different control functions. Each control function can operate independently, eliminating the two-card synchronization limitation encountered with competing solutions and providing greater flexibility in system architecture and control-card configuration. For equipment-side connectivity, six COM (RS-232) interfaces support direct connection to optical equipment, lighting systems, scanners, and other semiconductor packaging and testing peripherals. Onboard TPM 2.0 also provides a hardware-based security foundation and supports the platform's migration path toward Windows 11.
Industrial Design and Reliability Validation
To enhance equipment stability and reliability, Winome selected the IMB-X1715 for its industrial-oriented hardware design, component selection, and quality assurance processes. With an operating temperature range of -20°C to 70°C and a configurable watchdog timer of 0–255 seconds, the motherboard provides features suited to demanding industrial applications. Its design and component quality are further supported by multiple Design Quality Assurance (DQA) tests, including board boot-up, power and functional tests, functional aging, and power-on/off aging. These verification procedures help identify potential hardware issues and confirm functional consistency before deployment. By integrating a quality-assured motherboard with appropriate thermal management and system-level verification, Winome establishes a reliable computing foundation for continuous semiconductor inspection and control operations.
Stable 24/7 Operation with Rapid Local Support
The IMB-X1715 is designed for industrial computing applications, providing a reliable hardware foundation for equipment operating under continuous workloads. Integrated into a 4U industrial chassis with appropriate thermal management, the platform supports the operational requirements of semiconductor inspection equipment. The system architecture also accommodates the motherboard and required expansion cards within a 4U industrial chassis, providing the space and expansion capability required for the integrated computing and control platform. In addition, Winome provides responsive local technical support and rapid component replacement, enabling timely assistance when hardware issues occur and helping shorten troubleshooting and service time to maintain high equipment availability.
Benefits
High Inspection Performance and Yield with Cost Efficiency:
ASRock Industrial IMB-X1715, powered by Intel® Core™ Ultra Series 2 processors and supporting up to 256GB of DDR5 memory, provides the computing resources required for high-resolution 25 MP 3D AOI inspection and equipment-control workloads. By selecting and integrating the appropriate computing platform, Winome helps maintain consistent inspection performance and support inspection yield while providing a cost-effective alternative to a Xeon-based platform.
Flexible Single-Platform Integration:
Winome leverages the IMB-X1715's 7-slot PCIe architecture to configure dedicated cards for different control functions. This approach overcomes the two-card synchronization limitation encountered with competing solutions and providing greater flexibility in integrating vision inspection, motion control, and I/O within a single platform.
High Equipment Availability:
The industrial-grade IMB-X1715 provides a suitable hardware foundation for continuous equipment operation, while Winome's responsive local technical support and rapid component replacement help minimize unexpected equipment downtime, shorten troubleshooting and service recovery time, and maintain continuous inspection and production operations.
