Preliminary
iEPF-9042VS-EW2 Expandable Edge AIoT Platform
- Intel® Core™ Processors (Series 2) with H610 Chipset
- 2 x 262-pin DDR5 SO-DIMM up to 96GB (48GB per DIMM)
- 4 x USB 3.2 Gen2x1
- 2 x Intel 1G LAN
- 2 x COM, 2 x SATA3, 4 x DI, 4 x DO
- 1 x Displayport, 2 x HDMI 2.0b
- 2 x PCIe x8 (PCIe Gen4)
- With support for 192 mm (with optional system fans) x 148 mm x 60 mm; 221
- mm (without optional system fans) x 148 mmx 60 mm (D x H x W) max. and up to
- 75W expansion card or active graphic card
- Optional Kit: PoE function card, 10BASE-T1S function card, OOB function Card, System fans
- (If prefer to install above 75W expansion card)
Specification
Processor System
| CPU | Intel® Core™ Processors (Series 2) |
|---|---|
| Chipset | Intel® H610 |
| Socket | LGA 1700 |
Memory
| Technology | Dual Channel DDR5 5600MHz |
|---|---|
| Capacity | 96 GB (48 GB per DIMM) |
| Socket | 2 x 262-pin SO-DIMM |
Graphics
| Controller | Intel® UHD Graphics |
|---|---|
| DisplayPort | DisplayPort 1.4a , DP++ Max resolution up to 4096x2160@60Hz |
| HDMI | HDMI 2.0b Max resolution up to 4096x2160@60Hz |
Expansion Slot
| PCIe | 2 x PCIe Gen4 x8 |
|---|
Audio
| Interface | Realtek ALC897, High Definition Audio. |
|---|
Ethernet
| Controller/ Speed | 1 x Intel® i219V 1 x Intel® i210IT |
|---|---|
| Connector | 2 x RJ45 |
Front I/O
| DisplayPort | 1 |
|---|---|
| HDMI | 2 |
| Ethernet | 2 x Intel 1G LAN |
| USB | 4 x USB 3.2 Gen2x1, 2 x Internal USB 3.2 Gen2x1 (Optional) |
| Audio | 1 x Line-in, 1 x Line-out |
| COM | 2 x RS232/422/485 |
| DIO | 4DIs/4DOs |
Storage
| SATA | 2 x SATA3 (6Gb/s) |
|---|---|
| CFast | 1 x Type II socket (Shared with SATA3) |
Watchdog Timer
| Output | From Super I/O to drag RESETCON# |
|---|---|
| Interval | 256 Segments, 0, 1, 2, ...255sec |
Power Requirements
| Input PWR | 9V~36V DC |
|---|
Environment
| Operating Temp | 45W CPU: - 40°C ~ 55°C (-40°F ~ 131°F) 65W CPU: - 40°C ~ 50°C (-40°F ~ 122°F) (w/airflow 0.5~0.8 m/s) |
|---|---|
| Storage Temp | -40°C~85°C ( -40°F~185°F) |
| Humidity | ~95% @ 40°C (non-condensing) |
| Shock | MIL-STD-810H, Method 516.8, Procedure I |
| Vibration | MIL-STD-810H, Method 514.8 |
| ESD | Contact +/-4kV, Air +/-8kV |
| EMC | EN61000-6-4/-2, CE & FCC Class A |
| Safety | LVD |
Mechanical
| Construction | Aluminum heatsink + Metal chassis |
|---|---|
| Mounting | Desk Mount |
| Dimensions | 187mm (W) x 231.1mm (D) x 200mm (H) (7.36" x 9.10" x 7.87") |
| Net Weight | 7.5kg |
Others
| OS Support | Windows 11 & Windows 10 & Linux |
|---|---|
| TPM | TPM 2.0 |
| Real-Time Enablement | TSN, TCC support under YOCTO |
The specification is subject to change without notice in advance. The brand and product names are trademarks of their respective companies. Any configuration other than original product specification is not guaranteed.